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Volume Manufacturing

Working with multiple suppliers to manufacture and deliver your highly configurable electronic products can be overwhelming, but more importantly risky. Speed, flexibility, and the detail to follow strict quality standards must be applied to the entire system – not just individual components. That’s why partnering with one supplier - like IEC Electronics reduces the level of risk because we control the supply chain of the key commodities along with the engineering know-how to solve complex technical challenges.

With 350,000 square feet across three US locations, IEC Electronics owns and controls the supply chain for critical manufacturing components beyond printed circuit board assembly (PCBA). We have precision metalworking and interconnect production facilities, complimented by design and test development services as well as in-house analysis and testing laboratories for risk mitigation management. This full service offering ensures all key components come together with accuracy for your complex electronic and electromechanical systems.

Full System
Assembly

Electronics
Manufacturing

Interconnect
Solutions

Precision
Metalworking

Optimizing Solder Volume SpecificationsRead More

Full System Assembly

IEC Electronics’ vertical manufacturing model of key commodities provides a seamless transition from concept to full production to aftermarket support. Our team of experts collaborate at every stage of the product lifecycle. Quality and reliability are built in to every key piece of the puzzle and because we’ve taken ownership of the entire process, your time-to-market is reduced and, so is your risk.

Vertical Manufacturing

Reliability Testing & System Configuration

Logistics & End Order Fulfillment

Aftermarket & Repair

  • In-house fabrication of critical components including cables, metals and PCBA integrated into one custom configured system
  • Complex mechanical and electromechanical assembly
  • Full product serialization and traceability down to the component level

  • Customized test strategy support to include development of:
    • Automated Functional Test
    • RF Performance Testing
    • HASS & Vibration
    • Dynamic ESS Testing
  • Final software and hardware system configuration

  • On-site logistics management of product and packaging
  • Direct order fulfillment to end customer
  • Demand pull delivery systems

  • Depot repair services
  • Warranty repair services
  • Product upgrades and enhancements

Electronics Manufacturing

Our complex printed circuit board assembly (PCBA) capabilities and processes provide customized solutions which meet and often exceed our customer’s requirements. With over 20 years in BGA experience, coupled with our continual investments in emerging technologies, our on-site laboratories staffed by experts in material science can solve your toughest board level challenges to ensure a seamless transition to production.

SMT/PTH Placement

BGA Process

Soldering Process

Conformal Coating

On-Site Process Validation Support

Customized Test Strategies

  • SMT chip component placement and soldering down to 01005
  • SMT component placement and soldering down to 0.3 mm pitch
  • Leadless SMT components: Land Grid Array (LGA), QFN
  • Automated PTH component placement (Axial and DIP)
  • Special processes supported: press-fit connectors, vacuum lamination

  • BGA ball pitch down to 0.4 mm
  • BGA size up to 2 inch square
  • Underfill and heat sink application
  • Mixed-Alloy Soldering (Pb-free Ball with Sn-Pb Paste)
  • Package-on-Package (PoP) Capable

  • Leaded or Lead Free soldering processes supported for IPC-A-610 or J-STD-001 class 3, rigid, rigid-flex and flex
  • No-clean or water-soluble fluxes supported
  • Convection reflow technology including a supported nitrogen environment
  • Wave, selective, and manual soldering and intrusive soldering supported for PTH

  • Acrylic, Silicone, Polyurethane and Parylene supported
  • Automated and manual spray available
  • Potting using two-part epoxy and RTV supported
  • Automated Conformal Coat Inspection

  • Non-destructive analysis capabilities: XRF, 2D X-Ray, 3D X-Ray, optical and laser microscopy
  • Destructive analysis: cross-sectional analysis, mechanical testing, microhardness, dye and pry, wetting balance, strain gage
  • IQ/OQ/PQ supported for medical products
  • Full product serialization and traceability down to the component level

  • AOI & AXI
  • In-Circuit Test/Flying Probe Test
  • Boundary Scan/In-system Programming
  • Automated Functional Test
  • RF Performance Testing
  • HASS & Dynamic ESS Testing

Interconnect Solutions

Interconnect solutions goes beyond cable and harness manufacturing. IEC Electronics has a dedicated staff of engineers who can custom design and fabricate your molded cable assemblies utilizing 3D printer technology to accelerate your time to market. Utilizing IEC’s advanced testing capabilities and specialty materials know-how also allow flexibility and assurance to optimizing the final product performance.

EMI/RFI Shielding

Over Molded Cables

RF & Coax Cable Assemblies

Complex Harnessing

Customized Test Strategies

  • Custom back shells terminated with overmold boots, strain reliefs, military connectors
  • Push on EMI Braiding
  • In-house test capabilities to verify shielding effectiveness

  • In-house mold design
  • 3D printer technology for rapid prototyping
  • Custom material compounding
  • Polyurethane, epoxy, polyester alkyd and silicone created mold cavities
  • Custom EMI Thermoplastic molding

  • Utilize numerous series of connectors and RG type coax cable
  • Custom designed small gauge coax cables
  • VSWR testing to 22 Gigahertz
  • Twin axial connectors and cables
  • Micro coax cable assemblies
  • Phase matched cables

  • Complex internal assemblies with multiple breakouts & junction points
  • Test to 5K VAC and 5K VDC
  • Wire marking capability
  • Multiple wire types including PVC, TPE, Teflon & Coax
  • Individual jackets are combined into one extruded outer jacket
  • With and without foil, braid shielding

  • Resistance tests (Kelvin)
  • Capacitance
  • Insertion loss
  • VSWR / S-parameters
  • Phase matching
  • High voltage AC/DC Insulation resistance
  • On-site laboratory testing to verify cleanliness of cables designed for Space

 

Precision Metalworking

Integrating critical elements beyond PCBA, IEC Electronics offers engineering services for your metal fabrication and machining components. From conception to full production, our expertise in precision metal working can optimize your design for quality and manufacturability.

Design Services

Fabrication & Welding

CNC Machining

Electromechanical Assembly

Finishing Services

Quality Control Environment

  • Finite Element Analysis (FEA)
  • Design for Manufacturing (DfM)
  • Reverse Engineering
  • Solid works 3D Modeling
  • Chassis & Enclosure design
  • Mechanical Drafting & Fabrication Drawings

  • Laser Cutting
  • CNC Turret punching and forming
  • GMAW, GTAW, Robot, Resistive spot welding

  • Materials such as brass, copper, titanium, and plastics
  • CNC Machining
    • Multi axis
    • Horizontal
    • Vertical
  • In-line inspection capabilities

  • Fully tested integrated sub-assemblies complete with materials such as
    • Belts
    • Gears
    • Pulleys
    • Circuit boards
    • Cable assemblies

  • Plating
  • Painting – powder coat & liquid
  • Graining
  • Silk Screening

  • Clean room environment to meet specific customer requirements including:
    • FOD control
    • Burr requirements
    • Cosmetics
    • Extremely tight tolerances
  • Quality Assurance Emphasis on Cosmetics
    • Lumination that exceeds 300 candlepower for inspection
    • Profilometer
    • Gloss meter
    • Colorimeter
    • Black light inspection

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