Testing Methodologies for Electronic Components- IEC Electronics
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TESTING METHODOLOGIES
Whether you need maximum value and fast response from a single test or complete outsourced integration with our manufacturing services, IEC Electronics can perform testing to meet your requirements with strict adherence to industry standards.
Mechanical Testing
Mechancial Shock Testing
Used to detect the presence of loose particles inside a device cavity. Often caused by dirt, fibers, solder residues, and other elements trapped inside the cavity during the sealing process. The presence of loose particles may affect reliability and functionality. It is a non-destructive test used in total lot screening applications
Test to: MIL-STD-883 Method 2020
Resistance to Solvents testing
Tests the ability of a device to withstand exposure to solvents. That solvents will not cause mechanical, electrical, or material damage to the device. The test validates ink-printed markings and physical surface of a component using liquid solvents.
Test to: AEC-Q101, JESD22-B107, MIL-STD-202 Method 215, MIL-STD-883 Method 2015
Solderability testing
Evaluates the solderability of terminations using SnPb or Pb-free solder. This also involves preconditioning to assess device package solderability.
Test to: JSTD-002, MIL-STD-883 Method 2003, MIL-STD-202 Method 208, AEC-Q101
Accelerated Bias Aging
Determines the reliability and quality of semiconductor devices. It combines elevated temperate and voltage to accelerate failure mechanisms. Includes:
- Burn-In
- High Temperature Operating Life (HTOL)
- Low Temperature Operation
Cyclic Moisture Resistance
Evaluating the resistance to high-humidity and heat conditions typical of tropical environments
Test to: MIL-STD-883 Method 1004, MIL-STD-202 Method 106, JESD22-A110, JESD22-A113, J-STD-035,
J-STD-020
Highly Accelerated Stress Test (HAST)
Evaluates a sample’s resistance to humidity in an accelerated manner by combining high temperature, high relative humidity, and high atmospheric pressure with or without electrical bias. Similar to THB testing, as they both test for the same failure mechanism
Test to: JESD22-A110
Moisture/Reflow Sensitivity Level Testing (MSL)
Identifies the classification level of non-hermetic solid-state surface mount devices (SMDs) that are sensitive to moisture-induced stress. Used to determine how SMDSs should be properly packaged, stored, and handled to avoid damage in ambient room conditions during assembly, solder reflow attachment, and/or repair operating. This will determine classification level for Preconditioning.
Test to: JESD22-A113, J-STD-020, J-STD-035
Preconditioning Test
Used to measure the resistance of non-hermetic surface mount devices to worst-case moisture absorption followed by the soldering process and rework. Performed prior to package level reliability testing to simulate effects of board assembly on non-hermetic devices where moisture may have been absorbed during normal storage.
Test to: JESD22-A113, J-STD-020, J-STD-035
Steam Aging
Designed to artificially age components and circuit boards, to replicate shelf life
Test to: IPC-650, JSTD-002, MIL-STD-883 Method 2003, MIL-STD-202 Method 208, AEC-Q101, J-STD-002
Temperature Cycling/Thermal Cycling Testing
Determines the ability to withstand exposure to alternating extremes of high and low temperatures. Test conditions vary based on type of sample being tested. Specific cycling rates and other test conditions for components, boards, solder interconnects, or tin whisker evaluations can be specified. Used in evaluating reliability and catching early-term, latent defects.
Test to: JESD22-A104, MIL-STD-750 Method 1051, MIL-STD-883 Method 1010, MIL-STD-202 Method 107
Temperature Storage Testing
Measures device resistance to temperature storage environment.
Test to: JESD22-A103, MIL-STD-883 Method 1008
Thermal Shock Testing
Accelerates failure modes due to rapidly changing temperatures. Methods utilized: liquid-to-liquid or air-to-air depending on device requirements
Test to: MIL-STD-202 Method 107, MIL-STD 883 Method 1010, MIL-STD 883 Method 1011
COMPONENT ANALYSIS
Systematic process of disassembling, testing, and inspecting electronic components to assess quality and reliability. Numerous electrical, mechanical, and environmental tests are performed to verify the internal design, materials, construction, and workmanship. This is done to reveal components with anomalies or defects that may cause degradation or system failure.
DPA is routinely used in the aerospace industry during up-screening to qualify commercial off-the-shelf (COTS) to class “S”.
Testing Capabilities:
- Ball Shear Strength
- Die Shear Strength
- Digital Microscopy
- External Visual Inspection
- Glassivation Layer Inspection
- Internal Visual Inspection
- Cross-Sectioning
- Particle Impact Noise Detection (P.I.N.D)
- Scanning Electron Microscopy (SEM) Inspection
- SEM Metallization Inspection
- Solder Reflow/Moisture Sensitivity Testing
- Glassivation Thickness
- Metallization Thickness
- Hermeticity Testing (Fine Leak, Gross Leak)
- SEM, XRF, FTIR Elemental Analysis
- Scanning Acoustic Microscopy (C Mode)
- Acid De-encapsulation
- Sample De-lidding
Test to: DLA suitability, MIL-STD-1580, MIL-STD-883, MIL-STD-202, SSQ-25000
Series of non-destructive and destructive tests that evaluate the quality of a component. It examines and documents physical characteristics including material elemental composition, dimensions, and quality details of the assembly.
Acoustic Microscopy (CSAM)
Evaluates the integrity of package and device construction using ultrasound waves. Detects voids, delaminations, or underfill problems. We offer various imaging modes, including C mode and through scan.
Test to: IPC/JEDEC, J-STD-020, J-STD-033, J-STD-035, AS6171-6
Real Time X-Ray
Non-destructive inspection tool used to examine components not visible on the exterior of the sample
Test to: MIL-STD-202 Method 209
X-Plane X-Ray
Non-destructive tool that uses tomosynthesis (or CT) technique to create 2-D X-ray slices of any plane of a printed circuit board assembly
MATERIALS / SURFACE ANALYSIS
Micro FTIR Spectroscopy
A spectroscopic technique that uses interferometry to obtain an infrared spectrum of absorption or emission. Typically used to identify unknown organic and some inorganic materials.
Test to: ASTM-E334
Scanning Electron Microscopy (SEM) Inspection
Provides high resolution and high depth-of-field images by scanning the surface with a focused beam of electrons. When used in combination with Energy Dispersive X-Ray Spectroscopy (EDS), SEM also offers elemental identification. Beneficial for uses in failure analysis, dimensional analysis process characterization, reverse engineering, and particle identification
Test to: DLA Suitability per MIL-STD 883 Method 2018, AS6171-2
Energy Dispersive Spectroscopy (EDS)
Chemical analysis method used to determine the elemental composition of a point, line, or areas.
X-Ray Fluorescence (XRF) Elemental Analysis
Non-destructive technique used for elemental identification of materials.
Test to: MIL-STD-883 Method 2037, MIL-STD-1580 Requirement 9, AS6081, AS6171, ASTM-B658-98, JSD-213, IPC-4552
External Visual Inspection
A non-destructive test that is used to verify attributes of component, such as condition, part marketing, lead conditions, dimension, and surface quality.
Test to: MIL-STD-883 Method 2009, MIL-STD-750 Method 2068, MIL-STD-750 Method 2071, MIL-STD-1580, AS5553, AS6171, AS6081, GEIA-STD-006, JESD22-B101, IDEA-STD-1010
Internal Visual Inspection
Evaluates the quality of passivation, metallization, and other die related components
Test to: MIL-STD-750, MIL-STD-883, MIL-STD-1580
HERMETICITY TESTING
Hermetic Package Testing
Fine and Gross Leak testing is available to determine the seal integrity of the package. Ensures reliability of the device as loss of hermeticity will allow moisture and contaminants to enter the package cavity.
Test to: MIL-STD-883 Method 1014, MIL-STD-202 Method 112
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