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ROOT CAUSE FAILURE ANALYSIS

Identify the source of your quality and reliability issues through our multi-disciplinary approach to Root Cause Failure Analysis (RCFA).


CAPABILITIES

Electronic component issues can stem from numerous causes, including product design, manufacturing process, contamination, packaging, storage, or improper handling. Whether you are experiencing low yields, poor performance, degradation, or product failure, we know the complexities of each case are different and require a unique solution.


THOROUGH FORENSIC-STYLE ANALYSIS

At IEC Electronics, we investigate beyond what caused the problem, we determine how and why.

Our multi-step verification method begins with a conversation with our engineers, so that we can fully understand your problem, process, and goals. We then perform a series of non-destructive and destructive tests, including electrical, mechanical, materials, and chemical analysis. From this analysis, our experts draw meaningful insight to identify the source of the problem; then we provide clear recommendations to improve the product or manufacturing process to prevent the problem from reoccurring.

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  • Detection & Avoidance of counterfeit components

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EXPERIENCED, ACCURATE & EFFICIENT

We have the expertise to provide the most accurate and efficient testing possible.

IEC Electronics has developed solutions to cutting-edge technology challenges for industry leading companies. Each unique challenge provides an opportunity to advance our knowledge-base. Through this firsthand experience, our scientists have established proprietary testing procedures and techniques that allow us to identify solutions where other labs have failed. We deliver results across a wide range of electronic components, including semiconductors, integrated circuits (ICs), printed circuit boards (PCBs), microprocessors, assemblies, printed wiring boards, and memory devices.

In addition, as an EMS provider, our customers have access to leading experts with a full-range of knowledge of complex electronic device manufacturing and engineering.


LEADING EDGE TECHNOLOGY

The lab is outfitted with a wide-range of cutting-edge testing capabilities include Thermogravimetric Analysis coupled with Fourier Transform Infrared Spectroscopy (TGA/FTIR), Scanning Electron Microscopy/Energy Dispersive X-Ray Spectroscopy (SEM/EDS), and more. Our laboratory is fully equipped with up-to-date instrumentation to provide solutions for your reliability and quality challenges.

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