IEC's Technology Center was established in 1998 to provide our customers with extended, value-added services well beyond circuit board assembly. From the beginning, the goal has been to enhance the level of service that customers can expect from IEC. The Center's mission is to provide a single source of New Product Introduction (NPI) services to ensure that our customer's product gets to market as quickly as possible and at the lowest overall cost.

Design Services
IEC has been offering customers design services since 1994. Our design engineers' role in the new product development process involves combining expertise in analog, digital and RF design with manufacturing process know-how.

Prototype Assembly Production Services
Prototype assembly services play an important role in the NPI process by providing rapid design validation and the identification of Design for Manufacturing (DFM), Design for Test (DFT) and Design for Procurement (DFP) improvements prior to the transfer to production.

Materials Analysis Lab
IEC's Materials Analysis Lab provides analysis support services throughout the design, prototyping and volume manufacturing processes. Capabilities include cross-sectional analysis, material identification using x-ray fluorescence, solderability analysis, mechanical testing including micro-hardness testing and failure analysis. 

The focus is on preparing new designs for volume manufacturing and supplying engineering support needed throughout the product development cycle.

The Technology Center has the combined resources of design engineering, prototype manufacturing and materials laboratory analysis.

It provides yield prediction capability for new designscombined with significant DFM, DFT and DFP expertise.

IEC's NPI operations are fully supported by the resources of a high-tech EMS facility.