IEC's Technology Center was established in 1998 to provide our customers with extended, value-added services well beyond circuit board assembly. From the beginning, the goal has been to enhance the level of service that customers can expect from IEC.
The Center's mission is to provide a single source of New Product Introduction (NPI) services to ensure that our customer's product gets to market as quickly as possible and at the lowest overall cost.
It measures
10,000 square feet in size, and located inside IEC's 300,000 square foot
manufacturing facility in Newark, New York.
Design Services
IEC has been offering
customers design services since 1994. Our design engineers' role in the
new product development process involves combining expertise in analog,
digital and RF design with manufacturing process know-how.
Prototype Assembly Production
Services
Prototype assembly services play an important role in the NPI process
by providing rapid design validation and the identification of Design
for Manufacturing (DFM), Design for Test (DFT) and Design for Procurement
(DFP) improvements prior to the transfer to production.
Advanced Materials Technology Laboratory
IEC's Advanced Materials Technology Laboratory provides analysis support
services throughout the design, prototyping and volume manufacturing processes.
Capabilities include cross-sectional analysis, material identification
using x-ray fluorescence, solderability analysis, mechanical testing including
micro-hardness testing and failure analysis.
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| Click
above to see IEC's cross-sectional analysis |
Click above to see
IEC's BGA inspection |
The
focus is on preparing new designs for volume manufacturing and supplying
engineering support needed throughout the product development cycle.
The Technology Center has the combined resources of design engineering, prototype manufacturing and materials laboratory analysis.
It provides
yield prediction capability for new designscombined with significant DFM,
DFT and DFP expertise.
IEC's NPI operations are fully supported by the resources of a high-tech EMS facility.
Technology
Center Director Dr. Ronald Pratt has recently published a white paper
entitled "Capability-Based Yield Prediction Model for Electronic Assemblies" if you would like a copy of this paper, please request one by sending
an e-mail
to inq@iec-electronics.com.
