Low Volume/High Complex PCBA’s

• Up to 28 Layers; Fine Pitch Placement, Down to .3mm
  
  
• 0402 Discrete Components in Volume, 0201 and .01005 Capable
  
  
• 15+ Years BGA Experience; Millions Placed to Date
  • Most Complex Design – 101 BGA’s
    (58 Top Side, 43 Bottom Side)
    
    
• Via in Pad, Blind & Buried Vias

High Volume/Lower Complexity

• Mixed Technology
• Automated PTH Capability; Manual Assembly

Wide Variety of Board Laminates

• FR4, Nelco 13 IMS (Integrated Metal Substrates)

Nitrogen Inerted Soldering Process