Experience

IEC is a leader in lead-free manufacturing. As a matter of record, in 1996 IEC was awarded an Innovation Citation (uses SFX299.pdf ) from Nortel for the production of the world's first totally lead-free telephone. We have continued on the forefront of material and process technologies ever since.

Understanding

• Lead-Free Driving Forces
• Legislation
• Current Industry Activity
• Implementation Issues, Decisions and Costs
• Material Selection
• Capital Equipment Impact
• Component Issues
• PCB Issues
• Design Constraints
• Repair / Rework
• Quality and Reliability
• Training / Human Resources
• Preparation and Planning
• Environmental Impact
• Preparing for Lead-Free
  

Lead-Free Driving Forces
Why are manufacturers considering lead-free soldering?

• Legislation and Public Pressure
• Marketing Benefit and Competition
• Customer Request ( EMS providers)
• Environmental Consciousness
• Improve Recycling
• Technical or Cost Benefit

What is the definition of lead-free?  

• No clear definition
• 0.1% by material component most often discussed in context of legislation.

Key Legislation

• Directive 2002/96/EC: Waste Electrical and Electronic Equipment (WEEE)
• Ratified 27 January 2003
• Takes effect 1 July 2006
• Covers separate collection and recycling targets for electronic equipment.
• Includes:

  household appliances, IT and telecom equipment (PC's and phones), consumer equipment, lighting equipment, electrical tools (except large stationary, toys, leisure, sports equipment medical devices (except implant and infected), monitoring and control instruments, automatic dispensers

• Excludes: military

• Directive 2002/95/EC: Restriction of Hazardous Substances (RoHS)
• Ratified 27 January 2003
• Takes effect 1 July 2006
• Restricts use of hazardous materials in electronics such as cadmium, mercury, lead, chromium VI, PBB and PDBE
• Includes:

  household appliances, IT and telecom equipment, consumer equipment, lighting equipment, electrical tools (except large stationary), toys, leisure, sports equipment, automatic dispensers

• Excludes:

  military, medical devices / monitoring and control (decision 2005), high melting temp solders (>85% lead), servers, storage and storage array (until 2010), networking infrastructure equipment, automotive

Implementation Issues, Decisions and Costs

• Material Selection
• Capital Equipment Impact
• Component Issues
• PCB Issues
• Design Constraints
• Repair / Rework
• Quality and Reliability
• Training / Human Resources

IEC Preparations

• IEC has manufactured completely lead-free telephone assemblies for Nortel and understands the processes, materials and issues involved.
• Final equipment upgrade March 2004.
• Dedicated lead-free cell March 2004 fully operational and qualified by May 2004.
• Dedicated line with fully capable equipment.
• Separate stores for segregating lead-free components.
• Prototype capability available now through the IEC Technology Center .
• Design and Component Engineering teams geared up to support BOM/product conversions.

IEC Recommendations

• Assign a lead-free “coordinator”
• Monitor lead-free landscape.
• Keep abreast of legislation.
• Point person for IEC to keep informed.
• Evaluate impact of WEEE and RoHS directives on your products. Do exemptions apply? How soon do you need to react? Establish a roadmap.
• Start specifying lead-free components. Lead-free components can be used in either tin-lead or lead-free processes. (BGA's are an exception.)
• Select / Evaluate material selections for eventual implementation:
• Solder alloy
• Board finish
• Select an assembly for lead-free conversion
• Analyze BOM / AVL
• Determine / implement any design modifications
• Build prototypes
• Evaluate performance and reliability
• Establish a repeatable process for lead-free conversion and lead-free original designs.
• Establish recycling mentality at design stage.