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Led by Dr. Ronald Pratt, Ph.D. in Materials Science and 10 year electronics manufacturing industry veteran, IEC's Advanced Materials Technology Laboratory offers a wide range of analysis services to support electronics manufacturing applications. Typical applications include:
- BGA inspection
- Process qualification and validation
- Manufacturing process support
- Component/assembly failure analysis
- Materials evaluation and qualification
- Engineering experiments
- New technology development
- Troubleshooting analysis
- Special projects
- Cross-sectional analysis
- Real-time X-ray imaging
- X-ray fluorescence
- ERSAscope BGA inspection
- Optical microscopy (40X - 1600X)
- Laser sectioning microscopy
- Metallurgical microscopy
- Mechanical testing
- MicroHardness testing
- Tensile testing
- Meniscograph (wetting balance)
- Environmental chamber
- Solderability analysis
- Viscosity measurements
- Plating thickness measurements
- Thermal analysis
- Surface insulation resistance
- Copper mirror
In addition to the on-site capabilities supplied by the laboratory, IEC has access to additional capabilities through its working relationships with the University of Rochester Materials Science Department, the Rochester Institute of Technology's Center for Integrated Manufacturing Studies (CIMS) and the Process Laboratory at Universal Instruments in Binghamton, NY.
All divisions and departments within IEC Electronics have immediate access to the capabilities of the Advanced Materials Technology Laboratory. Laboratory services are also supplied to IEC's customers for analyses related to IEC-manufactured product.
New assembly technologies
developed in the Lab include a breakthrough lead-free soldering process.
Publications by Dr. Ronald Pratt:
"Process and Material Characterization for Lead-free Tin-Copper Solder Alloy", Surface Mount International 1998 Proceedings, pp. 589 - 602, 1998.
"The Effect of Solid-State Intermetallic Growth on the Fracture Toughness of Cu/63Sn-37Pb Solder Joints", IEEE Components, Packaging and Manufacturing Technology, Part A, Vol. 19, No. 1, pp. 134-141, 1996.
"Strategies for the Elimination of Solder Microball Formation During No-Clean Assembly", Surface Mount International 1995 Proceedings, pp. 677-683, 1995.
"The Effect of Substrate Surface Roughness on the Fracture Toughness of Cu/96.5Sn-3.5Ag Solder Joints", Journal of Electronic Materials, Vol. 23 No. 10, pp. 1047-1053, 1994.
"Mode I Fracture Toughness Testing of Eutectic Sn-Pb Solder Joints", Journal of Electronic Materials, Vol. 23, No. 4, pp. 375-381, 1994.
"The Effect of Noble Metal Contamination on the Mechanical Properties of Eutectic Tin-Lead Solder Joints", Ph.D. Thesis, University of Rochester, 1994.
"The Effect of Gold, Silver and Palladium Contamination on the Mechanical Properties of Cu/63Sn-37Pb Solder Joints", Sandia National Laboratories Contractor Report - SAND 93-7014, 1993.
"The Mechanical Properties of Cu/96.5Sn-3.5Ag Solder Joints with Comparisons to Cu/63Sn-37Pb Solder Joints, Sandia National Laboratories Contractor Report - SAND 93-7102, 1993.
"Capillary Soldering System for the Material Property Characterization of Solder Joints", Review of Scientific Instruments, Vol. 64, No. 11, pp. 3314-3319, 1993.
"The Application of Fracture Mechanics to Solder Joint Failures", The Metal Science of Joining, pp. 201-210, TMS Publications, Warrendale, PA, 1992.
"Fracture and Deformation Behavior of Eutectic Sn-Pb Solder Joints", MS Thesis, University of Rochester, 1991.
