IEC’s Materials Analysis Laboratory offers a wide range of analysis services to support electronics manufacturing applications. Typical applications include:
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Process qualification and validation (IQ/OQ/PQ)
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Destructive Physical Analysis (DPA) of PCB’s per IPC-6012
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Manufacturing process support
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Component / assembly failure analysis
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Materials evaluation and qualification
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Engineering experiments
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New technology development
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Troubleshooting analysis
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Special projects
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Capabilities include:
Mechanical Testing
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Vickers or Knoop microhardness testing
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Mechanical strength testing with Instron tensile tester
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Solderability testing with meniscograph
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Weight / mass with precision scale
Microsectioning
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Cross-sectional analysis
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Diamond band saw
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Grinding / polishing console
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Metallurgical microscope, up to 1000X magnification, bright field or dark field, polarized light
Microscopy
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Stereoscopes up to 40X
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Ersascope and hand-held tool for analysis of hidden features
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Laser scanning microscope (topography measurements)
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Web camera system with remote user-controlled stage
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Digital imaging system
Non-Destructive Analysis
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Real-time x-ray imaging
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Copper PTH plating measurement (microresistance and eddy current)
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Microhardness testing of ceramic capacitor
to judge brittleness of new supplier part
Cross-sectional analysis of flip chip connection
inside a BGA on a stacked microvia construction
Stereo image of metal migration caused by
improper flux usage during customer repair
Ersascope image of dewet ceramic BGA
caused by oxidation of eutectic Cu/Ag ball
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